Description
- Two-part, white, thermally conductive silicone
- Cures with the addition of heat
- Designed to allow bond line thicknesses 50 microns
- 20:1 Mix Ratio (Part A:Part B)
Applications
- For applications highly sensitive to outgas related contamination
- To provide heat transfer between electrical/electronic components and their heat sinks
- Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a non-flowable to limited flow material
Exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of ≤0.1% and CVCM of ≤0.010%
Product Details
| Property | Average Result |
|---|---|
| Thermal Conductivity | 0.64 W/(mK) |
| Extrusion Rate | 140 g/minute |
| Cure System | Platinum |
| Tensile | 400 psi (2.76 MPa) |
| Appearance | White |
| Cure | 30 minutes / 150 °C |
| Durometer | 55 Type A |
| Elongation | 225 % |
| Mix Ratio | 20:1 |
| Special Feature | |
| Tear | 55 ppi (9.7 kN/m) |
| Work Time | 3 hours |
| Comment | 0.64 W /mK (Tested per ASTM E1530) |
Encapsulation Technology
Watch our CareSil team explain the breakthrough Encapsulation Technology and demonstrate how easy it is to create transformative formulations with CES.
The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.