Description
- One part, low slump, solvent-free translucent silicone
- Cures at room temperature upon exposure to atmospheric moisture
Applications
- Well suited for use as an adhesive for bonding and sealing silicone materials
- For applications requiring the bonding of silicone to metals, urethanes and various other substrates
Product Details
Property | Average Result |
---|---|
Cure Type | RTV |
Mix Ratio | 1 PART |
Rheology | Thixotropic / non-slump |
Appearance | Translucent |
Cure | 72 hours / RTV |
Cure System | Acetoxy |
Durometer | 30 Type A |
Elongation | 565 % |
Extrusion Rate | 2.8 g/minute |
Flow Rate | 0.2 in (5.08 mm) |
Specific Gravity | 1.07 |
Stress at Strain | 170 psi / 200 % (1.17 MPa / 200 %) |
Substrate | Primerless: Aluminum / Glass / Polyurethane / Silicone / Titanium / With Primer: Polycarbonate |
Tack Free Time | 9 minutes |
Tensile | 730 psi (5.03 MPa) |
Comment | Low-slump, solvent-free translucent silicone |
Encapsulation Technology
Watch our CareSil team explain the breakthrough Encapsulation Technology and demonstrate how easy it is to create transformative formulations with CES.
The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.