Description
- Two-part, white, thermally conductive silicone
- Cures with the addition of heat
- Designed to allow bond line thicknesses ? 50 microns
- 20:1 Mix Ratio (Part A:Part B)
Applications
- For applications requiring low outgassing and minimal volatile condensables under extreme operating conditions to avoid condensation in sensitive devices
- To provide heat transfer between electrical/electronic components and their heat sinks
- Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a non-flowable to limited flow material
Meets or exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of ≤1% and CVCM of ≤0.1%
Product Details
| Property | Average Result |
|---|---|
| Thermal Conductivity | 0.64 W/(mK) |
| Extrusion Rate | 140 g/minute |
| Cure System | Platinum |
| Tensile | 400 psi (2.76 MPa) |
| Appearance | White |
| Cure | 30 minutes / 150 °C |
| Durometer | 55 Type A |
| Elongation | 225 % |
| Mix Ratio | 20:1 |
| Tear | 55 ppi (9.7 kN/m) |
| Work Time | 3 hours |
| Comment | *22) 0.6 W/mK, Thin Bond Line |
Encapsulation Technology
Watch our CareSil team explain the breakthrough Encapsulation Technology and demonstrate how easy it is to create transformative formulations with CES.
The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.