Description
- Two-part, translucent silicone system
- Incorporates an adhesion promoter
- Low viscosity
- Convenient 1:1 mix ratio (Part A:B)
Applications
- For applications requiring low outgassing and minimal volatile condensables under extreme operating conditions
- As an embedding or potting compound for electronic assemblies and components to provide protection from extremes in humidity, radiation, thermal stress and mechanical stress
- Use to adhere covers onto housings or for any application where grooves and other configurations require a material with superior flow
Meets or exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of ≤1% and CVCM of ≤0.1%
Product Details
| Property | Average Result |
|---|---|
| Cure System | Platinum |
| Viscosity | 2,600 cP (2,600 mPa*s) |
| Lap Shear | 50 psi (0.34 MPa) |
| Durometer | 30 Type A |
| Appearance | Clear |
| Cure | 1 hours / 65 °C |
| Elongation | 150 % |
| Mix Ratio | 1:1 |
| Specific Gravity | 1.01 |
| Tensile | 425 psi (2.93 MPa) |
| Comment | Primerless Adhesion |
Encapsulation Technology
Watch our CareSil team explain the breakthrough Encapsulation Technology and demonstrate how easy it is to create transformative formulations with CES.
The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.