Description
- A low density, two-part, red, thixotropic RTV silicone
- 100: 0.5 Mix Ratio (Base: Curing Agent)
Applications
- For applications requiring low outgassing and minimal volatile condensables under extreme operating conditions to avoid condensation in sensitive devices
- As a bonding, sealing, or potting material in electronic and space applications
- Provides radiation resistance, low thermal conductivity, oxidation stability, thermal stability and good ablative characteristics
- Especially useful to bond solar cells to solar array panels
- For applications requiring a broader operating temperature range
Meets or exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of ≤1% and CVCM of ≤0.1%
Product Details
| Property | Average Result |
|---|---|
| Cure System | Alkoxy |
| Viscosity | 125,000 cP (125,000 mPa*s) |
| Lap Shear | 100 psi (0.69 MPa) |
| Durometer | 50 Type A |
| Appearance | Red |
| Cte | |
| Cure | 7 days / RTV |
| Dielectric Strength | 645 volts/mil (25.16 kV/mm) |
| Elongation | 60 % |
| Mix Ratio | 100:0.5 |
| Specific Gravity | 0.64 |
| Tack Free Time | 13 hours |
| Tensile | 175 psi (1.21 MPa) |
| Work Time | 4 hours |
| Comment | Long Worktime, Low Density* 1, )Primed Lap Shear 100 psi (0.69 MPa) |
Encapsulation Technology
Watch our CareSil team explain the breakthrough Encapsulation Technology and demonstrate how easy it is to create transformative formulations with CES.
The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.