Description
- One-part, flowable, solvent free silicone
Applications
- For industrial or space applications requiring low outgassing and minimal volatile condensables under extreme operating conditions
- As a conformal coating on rigid and flexible circuit boards
- For encapsulating sensitive electronic components such as connectors and switches
- To provide protection against harsh environments while maintaining good dielectric properties
- For applications requiring a broader operating temperature range
Meets or exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of ≤1% and CVCM of ≤0.1%
Product Details
| Property | Average Result |
|---|---|
| Viscosity | 7,300 cP (7,300 mPa*s) |
| Appearance | Translucent |
| Tack Free Time | 50 minutes |
| Cure | 7 days / RTV |
| Cure System | Oxime |
| Mix Ratio | 1 PART |
| Refractive Index | 1.43 |
| Specific Gravity | 1.01 |
| Comment | Soft, very low modulus coating |
Encapsulation Technology
Watch our CareSil team explain the breakthrough Encapsulation Technology and demonstrate how easy it is to create transformative formulations with CES.
The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.